LOS ALTOS, CA and SANTA CLARA, CA – February 7, 2006 – Rambus Inc. (Nasdaq:RMBS), one of the world's premier technology licensing companies specializing in high-speed chip interfaces and Enigma Semiconductor, an emerging leader in networked communications technology, today announced that Enigma has licensed Rambus' ABP (Advanced Backplane) high-speed serial link interconnect technology for integration into Enigma's HybriCore™ switch architecture. The first chipset implementation of the HybriCore architecture with Rambus' ABP serial link technology is expected to sample in mid-2006.

The license agreement provides Enigma access to Rambus' 1-10Gbps serial link ABP interconnect technology suitable for both legacy and greenfield modular switching system applications. Designed for the development of next-generation 10 and 40Gbps enterprise, storage and data center networks, HybriCore is the first scalable switching architecture to deliver both cell and native packet switching across the system backplane.

The HybriCore implementation features Rambus' latest innovation in high-speed signal conditioning, the SmartDFE™ (Decision Feedback Equalization) technology. SmartDFE is an intelligent equalization method that addresses the issue of varying frequency responses within different channels in the same system. Overcoming the limitations of traditional inverse frequency equalization, SmartDFE significantly improves signal integrity by observing the characteristics and recent history of the data transmission, and applying this knowledge to make intelligent data recovery decisions.

"Robust serial link technology is a highly specialized and crucial component of a complete, integrated switching solution," said Rob Sturgill, president and CEO of Enigma Semiconductor. "Integrating Rambus' ABP technology into the HybriCore chipset provides a competitive edge for OEMs seeking to dramatically increase the speed and density of their next generation systems while providing a robust, flexible platform for low-risk development with advanced signaling technology."

Rambus' high-speed ABP technology implements dynamic adaptation algorithms to maintain the highest signal integrity over temperature and humidity variances - effects that become significant as data rates increase. The Rambus ABP solution offers reliable real-time link health monitoring through on-chip diagnostics, as well as advanced signal conditioning technologies such as reflection cancellation and dynamic adaptation algorithms.

"Next-generation ultrahigh-density networking systems employing HybriCore architecture demand the highest performance serial link technology," said Kevin Donnelly, vice president of engineering for Rambus Inc. "HybriCore is a natural first implementation for the high-speed, flexible, and robust signaling capabilities that our APB solution provides."

The Rambus family of ABP SerDes consists of a wide range of cells supporting data rates ranging from 1-10Gbps and supports standards and popular data rates such as Gigabit Ethernet, XAUI, turbo-XAUI and "double XAUI." Proven in advanced fabrication processes, Rambus' serial link ABP technology and signal integrity analysis services help engineers shorten development cycles, increase system performance over challenging signal environments, and reduce time-to-market. More information on Rambus ABP solutions is available at http://www.rambus.com/products/backplaneserdes.

SmartDFE is a trademark and Rambus is a registered trademark of Rambus Inc. Other trademarks that may be mentioned in this release are the intellectual property of their respective owners.

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